Internal gain fixing gives low gain spread and very good balance between the amplifiers 0,2 dB. A special feature of this device is a mute circuit which suppresses unwanted input signals during switching on and off. Referring to Fig. During the delay the amplifiers remain in their DC operating mode but are isolated from the non-inverting inputs on pins 1 and 9. Two thermal protection circuits are provided, one monitors the average junction temperature and the other the instantaneous temperature of the power transistors.
When the voltage at pin 3 is lower than Vref the non-inverting inputs pins 1 and 9 are disconnected from the amplifier. During switching on, a time delay is created between the reference voltage and the voltage at pin 3, during which the input terminal is disconnected, as illustrated in Fig.
Plastic or metal protrusions of 0. If the There is no soldering method that is ideal for all IC printed-circuit board has been pre-heated, forced cooling packages. Wave soldering is often preferred when may be necessary immediately after soldering to keep the through-hole and surface mounted components are mixed temperature within the permissible limit. However, wave soldering is not always suitable for surface mounted ICs, or for Repairing soldered joints printed-circuits with high population densities.
In these Apply a low voltage soldering iron less than 24 V to the situations reflow soldering is often used. A heatsink is required to prevent IC overheating.
TDA Features. This hi-fi stereo power amplifier is designed for mains fed applications. The circuit is designed for both symmetrical and asymmetrical power supply systems.
The gain is fixed internally at 30 dB. Two thermal protection circuits are provided, one monitors the average junction temperature and the other the instantaneous temperature of the power transistors. When the voltage at pin 3 is lower than Vref the non-inverting inputs pins 1 and 9 are disconnected from the amplifier. During switching on, a time delay is created between the reference voltage and the voltage at pin 3, during which the input terminal is disconnected, as illustrated in Fig.
Plastic or metal protrusions of 0. If the There is no soldering method that is ideal for all IC printed-circuit board has been pre-heated, forced cooling packages. Wave soldering is often preferred when may be necessary immediately after soldering to keep the through-hole and surface mounted components are mixed temperature within the permissible limit. However, wave soldering is not always suitable for surface mounted ICs, or for Repairing soldered joints printed-circuits with high population densities.
In these Apply a low voltage soldering iron less than 24 V to the situations reflow soldering is often used. The total contact time of successive solder waves must not exceed 5 seconds. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications. Stress above one or more of the limiting values may cause permanent damage to the device.
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